Invention Grant
- Patent Title: Composition of hot-melt adhesive film and method for producing shoe sole
-
Application No.: US16550276Application Date: 2019-08-25
-
Publication No.: US11779079B2Publication Date: 2023-10-10
- Inventor: Chuh-Yung Chen , Cheng-Wei Huang , Meng-Heng Wu , Chao-Yu Lai , Yu-Ning Shu , Chen-Chien Wang
- Applicant: NATIONAL CHENG KUNG UNIVERSITY
- Applicant Address: TW Tainan
- Assignee: NATIONAL CHENG KUNG UNIVERSITY
- Current Assignee: NATIONAL CHENG KUNG UNIVERSITY
- Current Assignee Address: TW Tainan
- Agency: CKC & Partners Co., LLC
- Priority: WO TCN2018102178 2018.08.24
- Main IPC: A43B13/32
- IPC: A43B13/32 ; C09J7/35 ; C09J7/10 ; B32B37/12 ; C09J5/06 ; A43B1/00 ; A43B13/04 ; A43B13/12 ; B29D35/12 ; A43D25/20 ; B29K101/12

Abstract:
The present invention relates to a composition of a hot-melt adhesive film and a method for producing a shoe sole. The composition of the hot-melt adhesive film comprises a hot-melt adhesive material and an electromagnetic radiation absorbing material. The hot-melt adhesive material includes ethylene vinyl acetate and thermoplastic materials. The electromagnetic radiation absorbing material is uniformly dispersed in the hot-melt adhesive material. Energy of an electromagnetic radiation can be absorbed by the electromagnetic radiation absorbing material, thereby producing thermal energy, further increasing temperature and adhering property of the hot-melt adhesive film. Therefore, a midsole and an outsole of the shoe sole can be adhered by the hot-melt adhesive film. Further, the hot-melt adhesive film is made from recyclable materials. Therefore, the hot-melt adhesive film is fully recyclable.
Public/Granted literature
- US20200060387A1 COMPOSITION OF HOT-MELT ADHESIVE FILM AND METHOD FOR PRODUCING SHOE SOLE Public/Granted day:2020-02-27
Information query