Invention Grant
- Patent Title: Forming device
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Application No.: US17121269Application Date: 2020-12-14
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Publication No.: US11779987B2Publication Date: 2023-10-10
- Inventor: Masayuki Saika , Masayuki Ishizuka , Norieda Ueno
- Applicant: SUMITOMO HEAVY INDUSTRIES, LTD.
- Applicant Address: JP Tokyo
- Assignee: SUMITOMO HEAVY INDUSTRIES, LTD.
- Current Assignee: SUMITOMO HEAVY INDUSTRIES, LTD.
- Current Assignee Address: JP Tokyo
- Agency: Michael Best & Friedrich LLP
- Priority: JP 15072089 2015.03.31
- The original application number of the division: US15717730 2017.09.27
- Main IPC: B21D26/047
- IPC: B21D26/047 ; B21D26/033 ; B21D19/00

Abstract:
A forming device includes a blow-forming die and a shielding member. The blow-forming die includes a first die that protrudes from a first die holder towards a second die holder and a second die that protrudes from the second die holder towards the first die holder. The shielding member is configured to extend from the first die holder to the second die holder before the blow-forming die commences forming a flange part of a pipe in a sub-cavity part. The sub-cavity part is between a main cavity part and the shielding member. The shielding member is separated from the first die and the second die.
Public/Granted literature
- US20210101199A1 FORMING DEVICE Public/Granted day:2021-04-08
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