A method for separating a workpiece along a separation line by using ultrashort laser pulses of a laser beam includes splitting the laser beam, using a beam splitter optical unit, into a plurality of partial laser beams. Each partial laser beam is focused by a focusing optical unit onto a surface and/or into a volume of the workpiece so that the partial laser beams are arranged next to one another and spaced apart from one another along the separation line. The method further includes implementing material ablation in the workpiece along the separation line by introducing the ultrashort laser pulses into the workpiece. The partial laser beams are repeatedly moved away from an initial position along the separation line by a deflection value and are subsequently moved back into the initial position. The deflection value is less than or equal to a distance between two adjacent partial laser beams.