Invention Grant
- Patent Title: Apparatus of cleaning a polishing pad and polishing device
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Application No.: US17199163Application Date: 2021-03-11
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Publication No.: US11780050B2Publication Date: 2023-10-10
- Inventor: Ji Hwan Cho
- Applicant: SK SILTRON CO., LTD.
- Applicant Address: KR Gumi-si
- Assignee: SK SILTRON CO., LTD.
- Current Assignee: SK SILTRON CO., LTD.
- Current Assignee Address: KR Gumi-si
- Agency: Lewis Roca Rothgerber Christie LLP
- Priority: KR 20200161048 2020.11.26
- Main IPC: B24B53/017
- IPC: B24B53/017 ; B24B53/00
Abstract:
An apparatus of cleaning a polishing pad includes: a first gas nozzle for spraying gas onto the pores of the polishing pad; and a first liquid nozzle for spraying a liquid to the pores of the polishing pad.
Public/Granted literature
- US20220161390A1 APPARATUS OF CLEANING A POLISHING PAD AND POLISHING DEVICE Public/Granted day:2022-05-26
Information query
