This workpiece molding apparatus has a mold member equipped with a pair of metal molds that hold therebetween a workpiece being a laminate of a workpiece body and a surface skin material, and that are capable of holding, through suction, the workpiece body and the surface skin material, said workpiece molding apparatus being provided with: a surface skin material retention part which is disposed laterally to the mold member so as to retain the surface skin material and which forms a level difference between the retaining position of the workpiece body and the retaining position of the surface skin material in a non-bonded area where the surface skin material is not bonded to the workpiece body; and a forward-and-backward moving member which is disposed at the portion where the level difference is formed at the non-bonded area so as to cover an upside of the non-bonded area of the workpiece body.