Invention Grant
- Patent Title: Method for manufacturing three-dimensional shaped object and three-dimensional shaping apparatus
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Application No.: US17719435Application Date: 2022-04-13
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Publication No.: US11780155B2Publication Date: 2023-10-10
- Inventor: Taki Hashimoto , Koichi Saito
- Applicant: Seiko Epson Corporation
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JP 21068182 2021.04.14
- Main IPC: B29C64/106
- IPC: B29C64/106 ; B29C64/209 ; B29C64/314 ; B29C64/321 ; B33Y50/02 ; B33Y10/00 ; B33Y30/00 ; B33Y40/10 ; B29C64/393 ; B29C64/386 ; B33Y50/00

Abstract:
In a method for manufacturing a three-dimensional shaped object, when an amount of a shaping material discharged toward a shaping surface per unit movement amount of a discharging unit is defined as a discharged shaping amount, in a layer forming step of forming a layer on the shaping surface, in a case in which a second partial shaped object to be shaped is not adjacent to a first partial shaped object that is shaped previously and is shaped with a gap between the first partial shaped object and the second partial shaped object, the second partial shaped object is shaped by setting the discharged shaping amount to a first discharged shaping amount, and in a case in which the second partial shaped object is adjacent to the first partial shaped object, the second partial shaped object is shaped by setting the discharged shaping amount to a second discharged shaping amount that is greater than the first discharged shaping amount.
Public/Granted literature
- US20220332037A1 Method For Manufacturing Three-Dimensional Shaped Object And Three-Dimensional Shaping Apparatus Public/Granted day:2022-10-20
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