Invention Grant
- Patent Title: Hotmelt silicone composition, encapsulant, hotmelt adhesive and optical semiconductor devise
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Application No.: US17456156Application Date: 2021-11-22
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Publication No.: US11780968B2Publication Date: 2023-10-10
- Inventor: Shunya Takeuchi
- Applicant: DuPont Toray Specialty Materials Kabushiki Kaisha
- Applicant Address: JP Tokyo
- Assignee: Dupont Toray Specialty Materials Kabushiki Kaisha
- Current Assignee: Dupont Toray Specialty Materials Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Lorenz & Kopf LLP
- Priority: JP 20195864 2020.11.26
- Main IPC: C09D183/04
- IPC: C09D183/04 ; C09J183/04 ; H01L23/29 ; C08G77/50 ; C09J183/14 ; H01L33/56 ; C09D183/14 ; C08G77/00
Abstract:
Hotmelt silicone compositions are provided including:
(A) a resinous alkenyl group-containing organopolysiloxane component, in which the silicon atom-bonded organic groups do not include an epoxy group-containing organic group, wherein the resinous alkenyl group-containing organopolysiloxane component includes
(A-1) a resinous alkenyl group-containing organopolysiloxane including at least two alkenyl groups per molecule and free from a (Ar2SiO2/2) unit, and
(A-2) a resinous alkenyl group-containing organopolysiloxane including at least two alkenyl groups per molecule and at least one (Ar2SiO2/2) unit;
(B) an organohydrogenpolysiloxane having at least two silicon atom-bonded hydrogen atoms per molecule; and
(C) a curing catalyst.
The resinous alkenyl group-containing organopolysiloxane (A-1) is included in an amount of about 5 mass % or more based on the total mass of all the organopolysiloxane components in the hotmelt silicone composition.
(A) a resinous alkenyl group-containing organopolysiloxane component, in which the silicon atom-bonded organic groups do not include an epoxy group-containing organic group, wherein the resinous alkenyl group-containing organopolysiloxane component includes
(A-1) a resinous alkenyl group-containing organopolysiloxane including at least two alkenyl groups per molecule and free from a (Ar2SiO2/2) unit, and
(A-2) a resinous alkenyl group-containing organopolysiloxane including at least two alkenyl groups per molecule and at least one (Ar2SiO2/2) unit;
(B) an organohydrogenpolysiloxane having at least two silicon atom-bonded hydrogen atoms per molecule; and
(C) a curing catalyst.
The resinous alkenyl group-containing organopolysiloxane (A-1) is included in an amount of about 5 mass % or more based on the total mass of all the organopolysiloxane components in the hotmelt silicone composition.
Public/Granted literature
- US20220162397A1 HOTMELT SILICONE COMPOSITION, ENCAPSULANT, HOTMELT ADHESIVE AND OPTICAL SEMICONDUCTOR DEVISE Public/Granted day:2022-05-26
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