Invention Grant
- Patent Title: Three-dimensional printing
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Application No.: US17047181Application Date: 2018-10-24
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Publication No.: US11780988B2Publication Date: 2023-10-10
- Inventor: Shannon Reuben Woodruff , Stephen G. Rudisill , Erica Fung , Rachael Donovan
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Agency: Dierker & Kavanaugh, P.C.
- International Application: PCT/US2018/057353 2018.10.24
- International Announcement: WO2020/086074A 2020.04.30
- Date entered country: 2020-10-13
- Main IPC: B29C64/165
- IPC: B29C64/165 ; C08K5/06 ; B33Y70/00 ; B33Y10/00 ; B29K77/00 ; B29K105/00

Abstract:
An example of a multi-fluid kit for three-dimensional (3D) printing includes an elasticity agent to be applied to at least a portion of a build material composition during 3D printing and a fusing agent to be applied to the at least the portion of the build material composition during 3D printing. The elasticity agent includes a plasticizer having: a formula (I): wherein n is an integer ranging from 3 to 8; or a formula (II): wherein m is an integer ranging from 3 to 8. The fusing agent includes an energy absorber.
Public/Granted literature
- US20210269620A1 THREE-DIMENSIONAL PRINTING Public/Granted day:2021-09-02
Information query