Invention Grant
- Patent Title: Silicon carbide seed crystal and method of manufacturing the same, and method of manufacturing silicon carbide ingot
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Application No.: US17385925Application Date: 2021-07-27
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Publication No.: US11781241B2Publication Date: 2023-10-10
- Inventor: Ching-Shan Lin
- Applicant: GlobalWafers Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: GlobalWafers Co., Ltd.
- Current Assignee: GlobalWafers Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: JCIPRNET
- Main IPC: C30B23/02
- IPC: C30B23/02 ; C30B29/36 ; C30B23/06 ; C01B32/956 ; H01L29/30

Abstract:
A silicon carbide seed crystal and method of manufacturing the same, and method of manufacturing silicon carbide ingot are provided. The silicon carbide seed crystal has a silicon surface and a carbon surface opposite to the silicon surface. A difference D between a basal plane dislocation density BPD1 of the silicon surface BPD1 and a basal plane dislocation density BPD2 of the carbon surface satisfies the following formula (1):
D=(BPD1−BPD2)/BPD1≤25% (1).
D=(BPD1−BPD2)/BPD1≤25% (1).
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