Invention Grant
- Patent Title: Scan compression through pin data encoding
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Application No.: US17747331Application Date: 2022-05-18
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Publication No.: US11782092B1Publication Date: 2023-10-10
- Inventor: Sandeep Jain , Shalini Pathak
- Applicant: STMicroelectronics International N.V.
- Applicant Address: CH Geneva
- Assignee: STMicroelectronics International N.V.
- Current Assignee: STMicroelectronics International N.V.
- Current Assignee Address: CH Geneva
- Agency: Slater Matsil, LLP
- Main IPC: G01R31/3185
- IPC: G01R31/3185 ; G01R31/317 ; G01R31/3183

Abstract:
A method for testing a chip comprising: receiving N scan-in chains of test data; using the N scan-in chains of test data to perform tests on the chip; receiving a merged expected test-result and masking-instruction signal on X pins of the chip from the off-chip test equipment, X being less than 2*N; decoding the merged expected test-result and masking-instruction signal to extract N decoded output signals, each of the N decoded output signals corresponding to a respective chain of test results.
Information query
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