A system for interleaving substrate under food products is provided. The system includes an interleaver assembly configured to interleave substrate with food products. A programmable logic controller (PLC) includes a sensor in communication with the interleaver assembly. The sensor is configured to detect an identifier provided on each substrate stock of a plurality of substrate stocks, and each identifier is associated with an interleaving profile. The interleaver assembly interleaves the substrate with the food product according to a specific interleaving profile in response to the sensor detecting the identifier on the substrate stock.