Invention Grant
- Patent Title: Electronics board mounting system
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Application No.: US17514003Application Date: 2021-10-29
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Publication No.: US11782484B2Publication Date: 2023-10-10
- Inventor: Ken Dickenson
- Applicant: FUJIFILM SonoSite, Inc.
- Applicant Address: US WA Bothell
- Assignee: FUJIFILM SONOSITE, INC.
- Current Assignee: FUJIFILM SONOSITE, INC.
- Current Assignee Address: US WA Bothell
- Agency: Womble Bond Dickinson (US) LLP
- Main IPC: G06F1/16
- IPC: G06F1/16 ; H05K1/02 ; H05K7/14 ; H05K1/18

Abstract:
Apparatuses and associated methods for mounting PCBs and other electronics boards in portable medical equipment and/or other portable and non-portable electronic devices are disclosed herein. In some embodiments, the technology disclosed herein can provide PCB mounting systems that isolate the PCB from detrimental shock, vibration, and/or strain, while also providing electrical ground paths that greatly reduce EMI and other electrical disturbances. Some embodiments of the mounting systems described herein include both elastomeric (e.g., rubber) components and resilient metallic grounding members that, when assembled together, provide favorable shock mounting as well as robust electrical grounding without the inconvenience of using separate shock mounts, grounding straps, etc.
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