Invention Grant
- Patent Title: Techniques to support mulitple interconnect protocols for an interconnect
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Application No.: US17674030Application Date: 2022-02-17
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Publication No.: US11782866B2Publication Date: 2023-10-10
- Inventor: Stephen R. Van Doren , Rajesh M. Sankaran , David A. Koufaty , Ramacharan Sundararaman , Ishwar Agarwal
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Trop, Pruner & Hu, P.C.
- Main IPC: G06F13/42
- IPC: G06F13/42 ; G06F13/14 ; G06F13/38

Abstract:
Embodiments may be generally direct to apparatuses, systems, method, and techniques to detect a message to communicate via an interconnect coupled with a device capable of communication via a plurality of interconnect protocols, the plurality of interconnect protocols comprising a non-coherent interconnect protocol, a coherent interconnect protocol, and a memory interconnect protocol. Embodiments also include determining an interconnect protocol of the plurality of interconnect protocols to communicate the message via the interconnect based on the message, and providing the message to a multi-protocol multiplexer coupled with the interconnect, the multi-protocol multiplexer to communicate the message utilizing the interconnect protocol via the interconnect with the device.
Public/Granted literature
- US20220197847A1 TECHNIQUES TO SUPPORT MULITPLE INTERCONNECT PROTOCOLS FOR AN INTERCONNECT Public/Granted day:2022-06-23
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