Invention Grant
- Patent Title: Distribution of over-configured logical processors
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Application No.: US17653798Application Date: 2022-03-07
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Publication No.: US11782872B2Publication Date: 2023-10-10
- Inventor: Jeffrey G. Chan , Seth E. Lederer , Jerry A. Moody , Hunter J. Kauffman
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Yee & Associates, P. C.
- Main IPC: G06F15/82
- IPC: G06F15/82 ; G06F13/36

Abstract:
Logical processor distribution across physical processors is provided. A set of logical processors of a number of logical processors defined for a particular logical partition of a plurality of active logical partitions is assigned to a physical processor chip having a greatest logical processor entitlement for the particular logical partition until no more logical processors can be assigned to that physical processor chip based on a logical processor entitlement of that physical processor chip being exhausted. Remaining logical processors of the number of logical processors defined for the particular logical partition are assigned to other physical processor chips of a plurality of physical processor chips assigned to the particular logical partition until all of the remaining logical processors have been assigned to a physical processor chip.
Public/Granted literature
- US20230281158A1 Distribution of Over-Configured Logical Processors Public/Granted day:2023-09-07
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