Invention Grant
- Patent Title: Merged buffer and memory device including the merged buffer
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Application No.: US18078732Application Date: 2022-12-09
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Publication No.: US11783889B2Publication Date: 2023-10-10
- Inventor: Chan Hui Jeong
- Applicant: SK hynix Inc.
- Applicant Address: KR Icheon-si
- Assignee: SK hynix Inc.
- Current Assignee: SK hynix Inc.
- Current Assignee Address: KR Icheon-si
- Agency: WILLIAM PARK & ASSOCIATES LTD.
- Priority: KR 20200100167 2020.08.10
- The original application number of the division: US17158767 2021.01.26
- Main IPC: G11C11/4093
- IPC: G11C11/4093 ; G11C11/4099 ; G11C5/06 ; G11C11/4091 ; G11C11/4094

Abstract:
A memory device according to the present technology includes a memory cell array configured to include planes having a plurality of memory cells, a page buffer connected to at least one memory cell among the memory cells through a bit line and configured to perform a sensing operation of reading data stored in the at least one memory cell connected to the bit line, a common reference voltage generator configured to generate a common reference voltage, a plurality of merged buffers configured to generate a reference signal using the common reference voltage, and control logic configured to control an operation of the common reference voltage generator and the merged buffers so that page buffer control signals generated based on the reference signal are supplied to the page buffer.
Public/Granted literature
- US20230115985A1 MERGED BUFFER AND MEMORY DEVICE INCLUDING THE MERGED BUFFER Public/Granted day:2023-04-13
Information query
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