The conductive wiring material composition includes (A) a polymer compound having a repeating unit “a” which has a structure selected from an ammonium salt, a lithium salt, a sodium salt, a potassium salt and a silver salt of any of fluorosulfonic acid, fluorosulfonimide and fluorosulfonamide and (B) metal powder, wherein the component (B) is contained with an amount exceeding 50 parts by mass based on 100 parts by mass of a solid content of the conductive wiring material composition excluding the component (B).