Invention Grant
- Patent Title: Inductor array component and inductor array component built-in substrate
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Application No.: US17076142Application Date: 2020-10-21
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Publication No.: US11783994B2Publication Date: 2023-10-10
- Inventor: Yoshimasa Yoshioka , Akinori Hamada
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto-fu
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto-fu
- Agency: Studebaker & Brackett PC
- Priority: JP 19193664 2019.10.24
- Main IPC: H01F27/32
- IPC: H01F27/32 ; H01F27/28 ; H01F27/29 ; H01F17/04 ; H01F17/00

Abstract:
An inductor array component includes a substantially flat plate-shaped main body including a magnetic layer having resin and metal magnetic powder contained in the resin, a first inductor wiring and a second inductor wiring disposed on the same plane in the main body and adjacent to each other, and a plurality of first vertical wirings extending in a first direction of a normal direction with respect to the plane so as to penetrate through inside of the main body and being exposed on a side of a first main surface of the main body. Also, the inductor array component includes a plurality of second vertical wirings extending in a second direction of the normal direction with respect to the plane so as to penetrate through the inside of the main body and being exposed on a side of a second main surface of the main body.
Public/Granted literature
- US20210125776A1 INDUCTOR ARRAY COMPONENT AND INDUCTOR ARRAY COMPONENT BUILT-IN SUBSTRATE Public/Granted day:2021-04-29
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