Invention Grant
- Patent Title: Multilayer capacitor and board having the same mounted thereon
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Application No.: US17836383Application Date: 2022-06-09
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Publication No.: US11784005B2Publication Date: 2023-10-10
- Inventor: San Kyeong , Chang Hak Choi , Jae Seok Yi , Bon Seok Koo , Jung Min Kim , Hae Sol Kang , Jun Hyeon Kim
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR 20190103742 2019.08.23
- Main IPC: H01G4/30
- IPC: H01G4/30 ; H01G4/012 ; H01G2/06 ; H01G4/008 ; H01G4/12

Abstract:
A multilayer capacitor includes a capacitor body including a dielectric layer and a plurality of internal electrodes, and external electrodes disposed on both ends of the capacitor body and connected to exposed portions of the plurality of internal electrodes, respectively. Each of the external electrodes includes a conductive layer disposed on the capacitor body to be connected to one or more of the plurality of internal electrodes, a conductive resin layer covering the conductive layer, and including a plurality of metal particles, a plurality of elastic fine powder particles each having an elastic powder particle and a metal film plated on a surface of the elastic powder particle, and a conductive resin surrounding the plurality of metal particles and the plurality of elastic fine powder particles and contacting the conductive layer, and a plating layer covering the conductive resin layer.
Public/Granted literature
- US20220301783A1 MULTILAYER CAPACITOR AND BOARD HAVING THE SAME MOUNTED THEREON Public/Granted day:2022-09-22
Information query