Invention Grant
- Patent Title: Ceramic electronic device and manufacturing method of the same
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Application No.: US17983154Application Date: 2022-11-08
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Publication No.: US11784008B2Publication Date: 2023-10-10
- Inventor: Kiyoshiro Yatagawa , Haruna Ubukata
- Applicant: TAIYO YUDEN CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: TAIYO YUDEN CO., LTD.
- Current Assignee: TAIYO YUDEN CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Stein IP, LLC
- Priority: JP 19208881 2019.11.19
- Main IPC: H01G4/30
- IPC: H01G4/30 ; H01G4/012 ; H01G2/06 ; H01G4/008 ; H01G4/12

Abstract:
A ceramic electronic device includes, a multilayer chip in which each of a plurality of dielectric layers and each of a plurality of internal electrode layers are alternately stacked, external electrodes provided on the first end face and the second end face, and a water repellent agent formed on a surface of the external electrodes. A thickness A (>0) of the water repellent agent on at least one of four faces of the external electrodes that cover an upper face in a stacking direction, a lower face in the stacking direction, and two side faces of the multilayer chip is larger than a thickness B (>0) of the water repellent agent on faces of the external electrodes that cover the first end face and the second end face.
Public/Granted literature
- US20230085334A1 CERAMIC ELECTRONIC DEVICE AND MANUFACTURING METHOD OF THE SAME Public/Granted day:2023-03-16
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