Invention Grant
- Patent Title: Tilted magnetron in a PVD sputtering deposition chamber
-
Application No.: US17285074Application Date: 2018-11-14
-
Publication No.: US11784032B2Publication Date: 2023-10-10
- Inventor: Lizhong Sun , Xiaodong Yang , Yufei Zhou , Yi Yang
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson + Sheridan, LLP
- International Application: PCT/CN2018/115365 2018.11.14
- International Announcement: WO2020/097815A 2020.05.22
- Date entered country: 2021-04-13
- Main IPC: H01J37/34
- IPC: H01J37/34 ; C23C14/35

Abstract:
A chamber includes a target (16) and a magnetron (50) disposed over the target (16). The magnetron (50) includes a plurality of magnets (52, 54). The magnetron (50) has a longitudinal dimension and a lateral dimension. The longitudinal dimension of the magnetron (50) is tilted with respect to the target (16) so the distances between magnets (52, 54) and the target (16) vary. As the magnetron (50) rotates during operation, the strength of the magnetic field produced by the magnetron (50) is an average of the various strengths of magnetic fields produced by the magnets (52, 54). The averaging of the strengths of the magnetic fields leads to uniform film properties and uniform target erosion.
Public/Granted literature
- US20210351024A1 TILTED MAGNETRON IN A PVD SPUTTERING DEPOSITION CHAMBER Public/Granted day:2021-11-11
Information query