Invention Grant
- Patent Title: Diamond semiconductor system and method
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Application No.: US17329117Application Date: 2021-05-24
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Publication No.: US11784048B2Publication Date: 2023-10-10
- Inventor: Adam Khan
- Applicant: AKHAN Semiconductor, Inc.
- Applicant Address: US IL Gurnee
- Assignee: AKHAN Semiconductor, Inc.
- Current Assignee: AKHAN Semiconductor, Inc.
- Current Assignee Address: US IL Gurnee
- Agency: Stevens Law Group
- Agent David R. Stevens
- The original application number of the division: US13273467 2011.10.14
- Main IPC: H01L21/04
- IPC: H01L21/04 ; H01L29/66 ; H01L29/868 ; H01L29/16 ; H01L21/22

Abstract:
Disclosed herein is a new and improved system and method for fabricating diamond semiconductors. The system may include a diamond malarial having n-type donor atoms and a diamond lattice, wherein 0.16% of the donor atoms contribute conduction electrons with mobility greater than 770 cm2/Vs to the diamond lattice at 100 kPa and 300K. The method of fabricating diamond semiconductors may include the steps of selecting a diamond material having a diamond lattice; introducing a minimal amount of acceptor dopant atoms to the diamond lattice to create ion tracks; introducing substitutional dopant atoms to the diamond lattice through the ion tracks; and annealing the diamond lattice.
Public/Granted literature
- US20220013361A1 Diamond Semiconductor System and Method Public/Granted day:2022-01-13
Information query
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