Invention Grant
- Patent Title: Method of fabricating microelectronic devices and related microelectronic devices, tools, and apparatus
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Application No.: US17241386Application Date: 2021-04-27
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Publication No.: US11784050B2Publication Date: 2023-10-10
- Inventor: Andrew M. Bayless , Brandon P. Wirz
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: TraskBritt
- Main IPC: H01L21/265
- IPC: H01L21/265 ; H01L21/324 ; H01L21/768 ; H01L21/78
Abstract:
A microelectronic device may have side surfaces each including a first portion and a second portion. The first portion may have a highly irregular surface topography extending from an adjacent surface of the microelectronic device. The second portion may have a less uneven surface extending from the first portion to an opposing surface of the microelectronic device. Methods of forming the microelectronic device may include creating dislocations in the wafer in a street between the one or more microelectronic devices by implanting ions and cleaving the wafer responsive to failure of stress concentrations near the dislocations through application of heat, tensile forces or a combination thereof. Related packages and methods are also disclosed.
Public/Granted literature
- US20220344161A1 METHOD OF FABRICATING MICROELECTRONIC DEVICES AND RELATED MICROELECTRONIC DEVICES, TOOLS, AND APPARATUS Public/Granted day:2022-10-27
Information query
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