Invention Grant
- Patent Title: Stage and plasma processing apparatus
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Application No.: US16998264Application Date: 2020-08-20
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Publication No.: US11784066B2Publication Date: 2023-10-10
- Inventor: Shota Ezaki , Katsuyuki Koizumi , Masanori Takahashi
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Nath, Goldberg & Meyer
- Agent Jerald L. Meyer; Tanya E. Harkins
- Priority: JP 19152156 2019.08.22
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/687 ; H01L21/683

Abstract:
A stage includes a base having an accommodation space therein, a dielectric layer provided on a first surface of the base and having a placement surface on which a substrate is placed, the dielectric layer including therein a plurality of heaters, and a heater control board disposed in the accommodation space and configured to drive the plurality of heaters. The base has an inlet in a second surface thereof that is opposite the first surface, the inlet being configured to introduce a coolant into the accommodation space.
Public/Granted literature
- US11735444B2 Stage and plasma processing apparatus Public/Granted day:2023-08-22
Information query
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