Invention Grant
- Patent Title: Pad structure for transferring flat panel
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Application No.: US17405528Application Date: 2021-08-18
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Publication No.: US11784083B2Publication Date: 2023-10-10
- Inventor: Jae Cheon Kwon
- Applicant: G-NONE.Co.Ltd.
- Applicant Address: KR Suwon-si
- Assignee: G-NONE.Co.Ltd.
- Current Assignee: G-NONE.Co.Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: NKL LAW
- Agent Jae Youn Kim
- Priority: KR 20200130746 2020.10.11
- Main IPC: H01L21/683
- IPC: H01L21/683 ; H01L21/67 ; C09J7/20 ; H01L21/687

Abstract:
Disclosed is a pad structure for transferring a flat panel that includes a circular adhesive force adjustment pattern having a predetermined diameter in the center of the pad body, and a ring-shaped microciliated member having a circumferential surface surrounding the first adhesive force adjustment pattern and including a plurality of cilia spaced apart from one another, and thus provides advantages of improving the adhesive force per unit area due to the functions of the pad, without a separate vacuum device, of being easily and simply attached to and detached from the blade at a desired position thereon, and of maximizing productivity by easily and smoothly performing quality control, preventive maintenance, and inventory management of the pad for transferring a flat panel based on serial number standardization (product information standardization).
Public/Granted literature
- US20220115258A1 PAD STRUCTURE FOR TRANSFERRING FLAT PANEL Public/Granted day:2022-04-14
Information query
IPC分类: