Invention Grant
- Patent Title: Method of manufacturing a molded flip chip package to facilitate electrical testing
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Application No.: US17502980Application Date: 2021-10-15
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Publication No.: US11784100B2Publication Date: 2023-10-10
- Inventor: Jee Won Chung , Dong Jin Kim , Byeung Ho Kim , Chang Hyun Kim
- Applicant: SK hynix Inc.
- Applicant Address: KR Icheon-si
- Assignee: SK hynix Inc.
- Current Assignee: SK hynix Inc.
- Current Assignee Address: KR Icheon-si
- Agency: WILLIAM PARK & ASSOCIATES LTD.
- Priority: KR 20190054896 2019.05.10
- The original application number of the division: US16669050 2019.10.30
- Main IPC: H01L21/66
- IPC: H01L21/66 ; H01L21/56 ; H01L21/78 ; H01L21/67 ; H01L23/00
Abstract:
A method of manufacturing a flip chip package includes forming a plurality of semiconductor chips and bonding the semiconductor chips to a package substrate. The method further includes electrically testing the plurality of semiconductor chips on the package substrate, molding the tested semiconductor chips, and singulating the molded chips. Electrically testing the semiconductor chips includes covering the semiconductor chips with a protection member.
Public/Granted literature
- US20220037214A1 METHOD OF MANUFACTURING A FLIP CHIP PACKAGE AND AN APPARATUS FOR TESTING FLIP CHIPS Public/Granted day:2022-02-03
Information query
IPC分类:
