Invention Grant
- Patent Title: Semiconductor device layout
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Application No.: US17373302Application Date: 2021-07-12
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Publication No.: US11784180B2Publication Date: 2023-10-10
- Inventor: Jhon Jhy Liaw
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: HAYNES AND BOONE, LLP
- The original application number of the division: US15718696 2017.09.28
- Main IPC: H01L27/02
- IPC: H01L27/02 ; H01L27/092 ; H01L29/06 ; H01L29/417 ; H01L21/8238 ; H01L29/66 ; H01L21/762 ; H01L29/45 ; H01L29/51 ; H01L29/49 ; H01L29/167 ; H01L29/165 ; H01L29/78 ; H01L29/08 ; H01L21/3105

Abstract:
Semiconductor devices and semiconductor cell arrays are provided herein. In some examples, a semiconductor device includes a multi-fin active region, a mono-fin active region, and an isolation feature between the multi-fin active region and the mono-fin active region. The multi-fin active region includes a first plurality of fins, a second plurality of fins parallel to the first plurality of fins, a first n-type field effect transistor (FET), and a first p-type FET. The mono-fin active region abuts the multi-fin active region. The mono-fin active region includes a first fin, a second fin different from the first fin, a second n-type FET, and a second p-type FET. The isolation feature is parallel to the first and second gate structures.
Public/Granted literature
- US20210343700A1 Semiconductor Device Layout Public/Granted day:2021-11-04
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