Invention Grant
- Patent Title: Light emitting device package and application thereof
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Application No.: US17881512Application Date: 2022-08-04
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Publication No.: US11784292B2Publication Date: 2023-10-10
- Inventor: Jong Min Jang , Chang Youn Kim
- Applicant: Seoul Viosys Co., Ltd.
- Applicant Address: KR Ansan-si
- Assignee: Seoul Viosys Co., Ltd.
- Current Assignee: Seoul Viosys Co., Ltd.
- Current Assignee Address: KR Ansan-si
- Agency: H.C. Park & Associates, PLC
- Main IPC: H01L33/54
- IPC: H01L33/54 ; H01L33/56 ; H01L33/08 ; H01L25/13 ; H01L33/00 ; H01L33/62

Abstract:
A light emitting device including a printed circuit board having a front surface and a rear surface, at least one light emitting source disposed on the front surface to emit light in a direction away from the printed circuit board, and a molding layer surrounding the light emitting source, in which the light emitting source includes a light emitting structure, a substrate disposed on the light emitting structure, and a plurality of bump electrodes disposed between the light emitting structure and the printed circuit board, the molding layer covers an upper surface of the substrate and a fine concavo-convex part is formed on a surface of the molding layer exposed to the outside, and the molding layer has a first thickness to transmit at least a fraction of light emitted from the light emitting source, and includes a filler to change a direction of emitted light.
Public/Granted literature
- US20220376148A1 LIGHT EMITTING DEVICE PACKAGE AND APPLICATION THEREOF Public/Granted day:2022-11-24
Information query
IPC分类: