Invention Grant
- Patent Title: Wireless communication apparatus and printed dual band antenna thereof
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Application No.: US17524910Application Date: 2021-11-12
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Publication No.: US11784411B2Publication Date: 2023-10-10
- Inventor: Ching-Wei Ling , Chih-Pao Lin
- Applicant: REALTEK SEMICONDUCTOR CORPORATION
- Applicant Address: TW Hsinchu
- Assignee: REALTEK SEMICONDUCTOR CORPORATION
- Current Assignee: REALTEK SEMICONDUCTOR CORPORATION
- Current Assignee Address: TW Hsinchu
- Agency: WPAT, P.C
- Priority: TW 9140207 2020.11.18
- Main IPC: H01Q1/38
- IPC: H01Q1/38 ; H01Q5/378 ; H01Q9/04

Abstract:
The present invention discloses a printed dual band antenna that includes a primary radiation portion and a parasitic radiation portion. The primary radiation portion is configured to perform signal transmitting and receiving based on a first resonant frequency and a second resonant frequency. The parasitic radiation portion is disposed on a neighboring side of the primary radiation portion, distanced from the primary radiation portion by a distance and electrically isolated from the primary radiation portion. The parasitic radiation portion couples to and resonates with the primary radiation portion to perform signal transmitting and receiving based on the second resonant frequency. The parasitic radiation portion is a grounded monopole parasitic antenna.
Public/Granted literature
- US20220158348A1 Wireless communication apparatus and printed dual band antenna thereof Public/Granted day:2022-05-19
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