Invention Grant
- Patent Title: Self-coupled wire connector using bend spring sheet and conductor sheet
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Application No.: US17837061Application Date: 2022-06-10
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Publication No.: US11784421B2Publication Date: 2023-10-10
- Inventor: Qiang Tan
- Applicant: Dongguan Chenming Electronic Technology Co., Ltd.
- Applicant Address: CN Dongguan
- Assignee: Dongguan Chenming Electronic Technology Co., Ltd.
- Current Assignee: Dongguan Chenming Electronic Technology Co., Ltd.
- Current Assignee Address: CN Dongguan
- Agent Jose Cherson Weissbrot
- Priority: CN 2210501941.8 2022.05.09
- Main IPC: H01R4/48
- IPC: H01R4/48 ; H01R11/09

Abstract:
The present disclosure relates to the technical field of electrical connection, in particular to a self-coupled wire connector using a bend spring sheet and conductor sheet, including a main body, a spring sheet and a conductor sheet; a coupling space for accommodating the spring sheet and the conductor sheet is formed inside the main body; a wire plugging hole passing through the coupling space is formed in the main body; the spring sheet and the conductor sheet are assembled in the coupling space, and are kept in a self-coupling state through the coupling space; a wire presses against the spring sheet and the conductor sheet to force the spring sheet and the conductor sheet to be self-coupled.
Public/Granted literature
- US20220302608A1 SELF-COUPLED WIRE CONNECTOR USING BEND SPRING SHEET AND CONDUCTOR SHEET Public/Granted day:2022-09-22
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