Invention Grant
- Patent Title: Radio frequency power amplifier and method of assembly thereof
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Application No.: US16975151Application Date: 2019-11-08
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Publication No.: US11784614B2Publication Date: 2023-10-10
- Inventor: Keqiu Zeng , Cong Zhou , Yuanxu Ding , Jungyang Zhang , Jun Ma
- Applicant: KONINKLIJKE PHILIPS N.V.
- Applicant Address: NL Eindhoven
- Assignee: Koninklijke Philips N.V.
- Current Assignee: Koninklijke Philips N.V.
- Current Assignee Address: NL Eindhoven
- Priority: WO TCN2018114862 2018.11.09 EP 212228 2018.12.13
- International Application: PCT/EP2019/080730 2019.11.08
- International Announcement: WO2020/094858A 2020.05.14
- Date entered country: 2020-08-24
- Main IPC: H03F3/21
- IPC: H03F3/21 ; G01R33/36 ; H03F1/30 ; H05K7/20 ; H05K9/00

Abstract:
Radio frequency amplifier (200) assembly with effective prevention of RF interference. The radio frequency amplifier comprises an electrically conductive housing (301) that defines an enclosed interior of the radio frequency amplifier assembly, an electrically conductive cooling plate (415) disposed inside the electrically conductive housing and having a first side and an opposite second side, the electrically conductive cooling plate being configured to divide the enclosed interior into a first enclosed region (501) and a second enclosed region (503), and a radio frequency signal processing circuit board (223) equipped with a radio frequency signal processing circuit, the radio frequency signal processing circuit board being positioned in the first enclosed region and disposed on the first side of the electrically conductive cooling plate, and a power supply module and a controller module positioned in the second enclosed region and disposed on the opposite second side of the electrically conductive cooling plate.
Public/Granted literature
- US20210376803A1 RADIO FREQUENCY POWER AMPLIFIER AND METHOD OF ASSEMBLY THEREOF Public/Granted day:2021-12-02
Information query
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