Invention Grant
- Patent Title: Low power interconnect using resonant drive circuitry
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Application No.: US17750398Application Date: 2022-05-23
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Publication No.: US11784648B2Publication Date: 2023-10-10
- Inventor: David A Huffman
- Applicant: Power Down Semiconductor, Inc.
- Applicant Address: US CA Fremont
- Assignee: Power Down Semiconductor, Inc.
- Current Assignee: Power Down Semiconductor, Inc.
- Current Assignee Address: US CA Fremont
- Agency: Patent Law Group
- Agent Brian Ogonowsky
- Main IPC: H03K19/17736
- IPC: H03K19/17736 ; H03K19/17704 ; H03K19/17728 ; H03K19/1776

Abstract:
A field programmable gate array (FPGA) comprises a set of configurable logic blocks (CLBs), input/output blocks (IOBs), and interconnect wiring for communicating data between the CLBs and IOBs. A resonating circuit provides a resonating signal to the circuit blocks. The circuit blocks provide the resonating signal to the interconnect wires to communicate a first binary value, and a static voltage to communicate a second binary value. The output signals of the circuit blocks change state when the resonating signal is at or near the static voltage. This reduces switching losses that exist within prior art FPGAs.
Public/Granted literature
- US20220393684A1 LOW POWER INTERCONNECT USING RESONANT DRIVE CIRCUITRY Public/Granted day:2022-12-08
Information query
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