Invention Grant
- Patent Title: Electronic device housing having a radio-frequency transmissive component
-
Application No.: US17469001Application Date: 2021-09-08
-
Publication No.: US11784673B2Publication Date: 2023-10-10
- Inventor: Daniel R. Bloom , Chelsea E. Wojeski , Edward Siahaan , Nathan Morris , Ryan S. Haley , Tian Shi Li , Toni Ristoski
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: APPLE INC.
- Current Assignee: APPLE INC.
- Current Assignee Address: US CA Cupertino
- Agency: Brownstein Hyatt Farber Schreck, LLP
- Main IPC: H04B1/3827
- IPC: H04B1/3827
Abstract:
An electronic device component including a thermoset composite material is described herein. The electronic device component may be a structural component of the housing and define an exterior surface of the housing. The electronic device component may also be transparent to radio-frequency signals.
Public/Granted literature
- US20220085843A1 ELECTRONIC DEVICE HOUSING HAVING A RADIO-FREQUENCY TRANSMISSIVE COMPONENT Public/Granted day:2022-03-17
Information query
