Invention Grant
- Patent Title: Housing assembly, method for manufacturing housing assembly, and electronic device
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Application No.: US16899018Application Date: 2020-06-11
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Publication No.: US11785124B2Publication Date: 2023-10-10
- Inventor: Sipeng Bi , Guangming Yang , Tibo Hou
- Applicant: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.
- Applicant Address: CN Guangdong
- Assignee: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.
- Current Assignee: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.
- Current Assignee Address: CN Dongguan
- Agency: Young Basile Hanlon & MacFarlane, P.C.
- Priority: CN 1910568846.8 2019.06.27 CN 1920991825.2 2019.06.27
- Main IPC: H04M1/02
- IPC: H04M1/02 ; B29C65/48 ; B29C65/00 ; C03B23/023

Abstract:
A housing assembly, a method for manufacturing the housing assembly, and an electronic device are provided according to the present disclosure. The housing assembly includes a housing body and a flexible film layer. The housing body has a bottom portion and at least one side wall connected with an outer edge of the bottom portion, and each of the at least one side wall and the bottom portion cooperatively define a bending angle larger than 70 degrees. The flexible film layer is disposed on a first surface of the housing body, and the flexible film layer has an elongation at break higher than or equal to 150%.
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