Invention Grant
- Patent Title: Signal processing device, signal processing method, and parameter search method
-
Application No.: US17910382Application Date: 2021-02-10
-
Publication No.: US11785340B2Publication Date: 2023-10-10
- Inventor: Hiroshi Arai , Yuriko Ohtsuka , Kenichiro Nishi , Takeshi Masuura , Norimitsu Okiyama , Yuji Matsui , Satoshi Takashima
- Applicant: Sony Semiconductor Solutions Corporation , Sony Group Corporation
- Applicant Address: JP Kanagawa
- Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION,SONY GROUP CORPORATION
- Current Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION,SONY GROUP CORPORATION
- Current Assignee Address: JP Kanagawa; JP Tokyo
- Agency: XSENSUS LLP
- Priority: JP 20045255 2020.03.16
- International Application: PCT/JP2021/005069 2021.02.10
- International Announcement: WO2021/186962A 2021.09.23
- Date entered country: 2022-09-09
- Main IPC: H04N23/68
- IPC: H04N23/68

Abstract:
A signal processing device according to the present technology includes a stacked auto encoder that processes an input signal from a sensor, a control line associated learner including a neural network and subjected to control line associated learning for performing learning by associating different event aspects related to a specific event with values of different control lines with a feature quantity obtained in an intermediate layer of the stacked auto encoder after pretraining as an input, and a refactorer that obtains a difference between a first output that is an output of the control line associated learner when a first value is given to the control line, and a second output that is an output of the control line associated learner when a second value different from the first value is given to the control line.
Public/Granted literature
- US20230135628A1 SIGNAL PROCESSING DEVICE, SIGNAL PROCESSING METHOD, AND PARAMETER SEARCH METHOD Public/Granted day:2023-05-04
Information query