Invention Grant
- Patent Title: Multi-dimensional microphone stand
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Application No.: US17453344Application Date: 2021-11-03
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Publication No.: US11785369B2Publication Date: 2023-10-10
- Inventor: Cheng-Yun Wu
- Applicant: AVerMedia TECHNOLOGIES, INC.
- Applicant Address: TW New Taipei
- Assignee: AVerMedia TECHNOLOGIES, INC.
- Current Assignee: AVerMedia TECHNOLOGIES, INC.
- Current Assignee Address: TW New Taipei
- Agency: CKC & Partners Co., LLC
- Priority: TW 9138886 2020.11.06
- Main IPC: H04R1/08
- IPC: H04R1/08 ; F16M13/02 ; F16M11/04 ; F16M11/20 ; F16M11/10

Abstract:
A multi-dimensional microphone stand includes a first rotational module, a first rotational arm, a second rotational module, a second rotational arm, and a third rotational module. The first rotational arm is connected to the first rotational module, and the second rotational module is connected to the first rotational arm, and the first rotational module is rotatable relative to the second rotational module. The second rotational arm is connected to the second rotational module, the third rotational module is connected to the second rotational arm, and the second rotational module is rotatable relative to the third rotational module. In addition, in a folded state, the first rotational arm and the second rotational arm are arranged side by side and connected to the second rotational module in parallel.
Public/Granted literature
- US20220150612A1 MULTI-DIMENSIONAL MICROPHONE STAND Public/Granted day:2022-05-12
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