Invention Grant
- Patent Title: Microphone
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Application No.: US17571834Application Date: 2022-01-10
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Publication No.: US11785371B2Publication Date: 2023-10-10
- Inventor: Satoshi Yoshino
- Applicant: Audio-Technica Corporation
- Applicant Address: JP Tokyo
- Assignee: AUDIO-TECHNICA CORPORATION
- Current Assignee: AUDIO-TECHNICA CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: WCF IP
- Priority: JP 21004698 2021.01.15
- Main IPC: H04R1/08
- IPC: H04R1/08 ; H04R1/04

Abstract:
A microphone includes an outer wall member having a sound hole, a first mesh arranged inside the outer wall member and made of Dutch weave, and a spacer having a diameter corresponding to an inner diameter of the outer wall member. The first mesh is pressed to an inside the outer wall member while a first surface of which is in contact with the first mesh. A second mesh is in contact with a second surface of the spacer and has water repellency. A microphone unit is stored under the second mesh.
Public/Granted literature
- US20220279261A1 MICROPHONE Public/Granted day:2022-09-01
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