Invention Grant
- Patent Title: Extensible and contractible wiring board and method for manufacturing extensible and contractible wiring board
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Application No.: US17318150Application Date: 2021-05-12
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Publication No.: US11785714B2Publication Date: 2023-10-10
- Inventor: Takayoshi Obata
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Nagaokakyo
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Nagaokakyo
- Agency: ArentFox Schiff LLP
- Priority: JP 18219247 2018.11.22
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/03 ; H05K3/00 ; H01B11/18 ; B32B5/00 ; B32B5/12 ; B32B5/14 ; H01L41/16 ; H01L41/18 ; H05K3/20
Abstract:
An extensible and contractible wiring board that includes an extensible and contractible wiring sheet having an extensible and contractible resin sheet and an extensible and contractible wiring on the extensible and contractible resin sheet, the extensible and contractible wiring including a conductive particle, a resin, and a void at an interface between the conductive particle and the resin; and a fixing sheet on a main surface of the extensible and contractible wiring sheet.
Public/Granted literature
Information query
