- Patent Title: Array substrate comprising an interlay insulation layer including at least two inorganic insulation layers and at least one organic insulation layer laminated one on another
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Application No.: US17241703Application Date: 2021-04-27
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Publication No.: US11785811B2Publication Date: 2023-10-10
- Inventor: Ning Liu , Jun Liu , Wei Song , Qinghe Wang , Bin Zhou , Liangchen Yan
- Applicant: HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD. , BOE TECHNOLOGY GROUP CO., LTD.
- Applicant Address: CN Anhui
- Assignee: HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD.,BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD.,BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Anhui; CN Beijing
- Agency: BROOKS KUSHMAN P.C.
- Priority: CN 2010428682.1 2020.05.20
- Main IPC: H01L29/08
- IPC: H01L29/08 ; H10K59/124 ; H10K59/126 ; H10K59/12

Abstract:
An array substrate, a method for manufacturing the array substrate and a display device are provided. The array substrate includes: a base substrate, and a thin film transistor, a storage capacitor, and a lapping pattern for connecting the thin film transistor to the storage capacitor arranged on the base substrate; wherein the thin film transistor includes a semiconductor layer, a gate insulation layer, a gate electrode, an interlayer insulation layer, a source electrode and a drain electrode arranged sequentially in that order; the interlayer insulation layer includes at least two inorganic insulation layers and at least one organic insulation layer laminated one on another, and both a layer proximate to the base substrate and a layer distal to the base substrate in the interlayer insulation layer are the inorganic insulation layers.
Public/Granted literature
- US20210367017A1 ARRAY SUBSTRATE, METHOD FOR MANUFACTURING THE SAME AND DISPLAY DEVICE Public/Granted day:2021-11-25
Information query
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