Invention Grant
- Patent Title: Wiring member and attachment structure of wiring member
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Application No.: US17312786Application Date: 2018-12-17
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Publication No.: US11791064B2Publication Date: 2023-10-17
- Inventor: Tetsuya Nishimura , Takuya Kaba
- Applicant: Sumitomo Wiring Systems, Ltd.
- Applicant Address: JP Mie
- Assignee: SUMITOMO WIRING SYSTEMS, LTD.
- Current Assignee: SUMITOMO WIRING SYSTEMS, LTD.
- Current Assignee Address: JP Mie
- Agency: GREENBLUM & BERNSTEIN, P.L.C.
- International Application: PCT/JP2018/046281 2018.12.17
- International Announcement: WO2020/129110A 2020.06.25
- Date entered country: 2021-06-10
- Main IPC: H01B7/40
- IPC: H01B7/40 ; H02G3/32 ; B60R16/02 ; H01B7/00

Abstract:
A wiring member includes a wiring body and an attaching member attached to the wiring body to attach the wiring body to an attaching target. The wiring body includes a wire-like transmission member and a base member holding the wire-like transmission member. The attaching member includes a base material attachment part plastically deformed and sandwiching the base member from both sides of the base member in a front-back direction and an attaching target attachment part attached to an attaching target of the wiring body.
Public/Granted literature
- US20220059255A1 WIRING MEMBER AND ATTACHMENT STRUCTURE OF WIRING MEMBER Public/Granted day:2022-02-24
Information query