Invention Grant
- Patent Title: Multilayer ceramic electronic component
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Application No.: US17500203Application Date: 2021-10-13
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Publication No.: US11791103B2Publication Date: 2023-10-17
- Inventor: Hyeg Soon An , Seung In Baik , Ji Su Hong , Eun Ha Jang , Hee Sun Chun , Jae Sung Park , Je Hee Lee
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: MORGAN, LEWIS & BOCKIUS LLP
- Priority: KR 20210024912 2021.02.24
- Main IPC: H01G4/30
- IPC: H01G4/30 ; H01G4/008 ; H01G4/12 ; H01G4/012

Abstract:
A multilayer ceramic electronic component includes: a ceramic body having a capacitance formation portion, and including a dielectric layer and a first internal electrode and a second internal electrode with the dielectric layer interposed therebetween, a first margin portion disposed on the surface of the capacitance formation portion, and a second margin portion disposed on the other surface of the capacitance formation portion; a first external electrode; and a second external electrode. A following formula 1 is satisfied, [formula 1]−0.1≤(Tm−Ta)/Ta, where in the formula 1, Tm is an average height of a central region of the margin portion, and Ta is an average height of an outer region of the capacitance formation portion in a second direction.
Public/Granted literature
- US20220270824A1 MULTILAYER CERAMIC ELECTRONIC COMPONENT Public/Granted day:2022-08-25
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