Invention Grant
- Patent Title: Key structure
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Application No.: US17477551Application Date: 2021-09-17
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Publication No.: US11791110B2Publication Date: 2023-10-17
- Inventor: Hung-Chi Chen , Cheng-Wen Hsieh
- Applicant: Acer Incorporated
- Applicant Address: TW New Taipei
- Assignee: Acer Incorporated
- Current Assignee: Acer Incorporated
- Current Assignee Address: TW New Taipei
- Agency: JCIPRNET
- Priority: TW 0105721 2021.02.19
- Main IPC: H01H3/12
- IPC: H01H3/12 ; H01H9/52 ; G06F1/20 ; G06F3/02

Abstract:
A key structure including a base, a platform, a scissor structure, a heat conducting member, an elastic member, and a key cap is provided. The scissor structure is movably pivoted between the platform and the base. The heat conducting member is disposed on the platform. The elastic member is disposed on the base and is structurally in contact with the heat conducting member by passing through an opening of the platform. The key cap is disposed on the platform, and the heat conducting member is clamped between the key cap and the platform.
Public/Granted literature
- US20220270832A1 KEY STRUCTURE Public/Granted day:2022-08-25
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