Invention Grant
- Patent Title: Workpiece holder, wafer chuck, wafer holding method
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Application No.: US17010855Application Date: 2020-09-03
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Publication No.: US11791192B2Publication Date: 2023-10-17
- Inventor: Cheng-Shiuan Wong , Chih-Chiang Tsao , Chao-Wei Chiu , Hao-Jan Pei , Wei-Yu Chen , Hsiu-Jen Lin , Ching-Hua Hsieh , Chia-Shen Cheng
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: JCIPRNET
- Main IPC: H01L21/68
- IPC: H01L21/68 ; H01L21/683 ; H01L21/687 ; H01L21/56 ; H01L23/00
Abstract:
A workpiece holder includes a chuck body and a seal ring. The chuck body includes a receiving surface configured to receive a workpiece and at least one vacuum port configured to apply a vacuum seal. The seal ring surrounds a side surface of the chuck body. A top surface of the seal ring is higher than the receiving surface of the chuck body, and the workpiece leans against the seal ring when the vacuum seal is applied between the workpiece and the chuck body.
Public/Granted literature
- US20210225684A1 WORKPIECE HOLDER, WAFER CHUCK, WAFER HOLDING METHOD Public/Granted day:2021-07-22
Information query
IPC分类:
