Monolithic microwave integrated circuits (MMICs) with backside interconnects for fanout-style packaging are disclosed. Fanout-style packaging, such as fanout wafer (FOWLP) or fanout panel-level packaging (FOPLP), facilitates a high density package for MMICs. However, the fanout-style packaging may produce undesired electromagnetic (EM) coupling between a MMIC die and metal features in a redistribution layer (RDL) of the FOW/PLP package and/or a next higher assembly (NHA). In an exemplary aspect, a circuit package according to this disclosure includes the MMIC die and an RDL. The MMIC includes a chip side with components which may undesirably couple to metal signal lines (e.g., package metal interconnects) in the RDL. The chip side of the MMIC is oriented away from the RDL to reduce such EM coupling.