Invention Grant
- Patent Title: Memory and logic chip stack with a translator chip
-
Application No.: US17315965Application Date: 2021-05-10
-
Publication No.: US11791326B2Publication Date: 2023-10-17
- Inventor: Mukta Ghate Farooq , Arvind Kumar , Ravi Nair
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Edward J. Wixted, III
- Main IPC: H01L25/18
- IPC: H01L25/18 ; H01L25/065 ; H01L23/00 ; H01L23/367

Abstract:
A multichip module with a vertical stack of a logic chip, a translator chip, and at least one memory chip. The multichip module includes a logic chip, a translator chip over and vertically connecting to the logic chip, and at least one memory chip above and vertically connecting to the translator chip where the translator chip is one of a chip with active devices or a passive chip.
Public/Granted literature
- US20220359482A1 MEMORY AND LOGIC CHIP STACK WITH A TRANSLATOR CHIP Public/Granted day:2022-11-10
Information query
IPC分类: