Invention Grant
- Patent Title: Wideband amplifier linearization techniques
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Application No.: US17406585Application Date: 2021-08-19
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Publication No.: US11791777B2Publication Date: 2023-10-17
- Inventor: Kun-Long Wu , James June-Ming Wang
- Applicant: Kyocera International Inc.
- Applicant Address: US CA San Diego
- Assignee: Kyocera International Inc.
- Current Assignee: Kyocera International Inc.
- Current Assignee Address: US CA San Diego
- Agency: Imperium Patent Works
- Agent Zheng Jin
- Main IPC: H03F3/45
- IPC: H03F3/45 ; H03F1/32 ; H03F1/42

Abstract:
A wideband power amplifier (PA) linearization technique is proposed. A current interpolation technique is proposed to linearize power amplifiers over a wide bandwidth. The wideband power amplifier linearization technique employs a novel transconductance Gm linearizer using a current interpolation technique that achieves improvement in the third order intermodulation over wide bandwidth for a sub-micron CMOS differential power amplifier. By using a small amount of compensating bias into an opposite phase differential pair, linearization over wide bandwidth is achieved and can be optimized by adjusting the compensating bias.
Public/Granted literature
- US20220060152A1 Wideband Amplifier Linearization Techniques Public/Granted day:2022-02-24
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