Invention Grant
- Patent Title: Headphone cover
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Application No.: US17596632Application Date: 2020-06-23
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Publication No.: US11792558B2Publication Date: 2023-10-17
- Inventor: Shuji Yokota
- Applicant: Shuji Yokota
- Applicant Address: JP Tochigi
- Assignee: Shuji Yokota
- Current Assignee: Shuji Yokota
- Current Assignee Address: JP Tochigi
- Agency: Rosenberg, Klein & Lee
- Priority: JP 19116744 2019.06.24
- International Application: PCT/JP2020/024681 2020.06.23
- International Announcement: WO2020/262411A 2020.12.30
- Date entered country: 2021-12-15
- Main IPC: H04R25/00
- IPC: H04R25/00 ; H04R1/10 ; H04R5/033

Abstract:
[Problem] To provide a headphone cover that does not block a sound from a headphone and is able to keep its fabric stably covering the headphone.
[Solving Means] A headphone cover 1 includes fabric 14 that has an opening in a position corresponding to the sound passage position on one side of an ear pad and is foldable at least from the one side toward another side of the ear pad by 90° and a core 16 disposed around the opening. The compressive yield force in the extending direction of the core 16 is equal to or greater than 0.0587 Mpa.
[Solving Means] A headphone cover 1 includes fabric 14 that has an opening in a position corresponding to the sound passage position on one side of an ear pad and is foldable at least from the one side toward another side of the ear pad by 90° and a core 16 disposed around the opening. The compressive yield force in the extending direction of the core 16 is equal to or greater than 0.0587 Mpa.
Public/Granted literature
- US20220167073A1 HEADPHONE COVER Public/Granted day:2022-05-26
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