Invention Grant
- Patent Title: Printed circuit board and optical transceiver
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Application No.: US17589443Application Date: 2022-01-31
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Publication No.: US11792915B2Publication Date: 2023-10-17
- Inventor: Osamu Kagaya
- Applicant: CIG Photonics Japan Limited
- Applicant Address: JP Kanagawa
- Assignee: CIG PHOTONICS JAPAN LIMITED
- Current Assignee: CIG PHOTONICS JAPAN LIMITED
- Current Assignee Address: JP Sagamihara
- Agency: MATTINGLY & MALUR, PC
- Priority: JP 21030323 2021.02.26
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/11

Abstract:
A printed circuit board includes: a conductor plate below the inner dielectric layer; some vias through the inner dielectric layer, bonded to the conductor plate, centered at respective points on an upper surface of the conductor plate; a ground conductor above the inner dielectric layer, bonded to the vias, extending outwardly from any quadrangle with vertices being the nearest four points of the points; an electromagnetic resonance plate above the inner dielectric layer and inside the quadrangle, electrically connected to the ground conductor and the vias with a portion other than a protruding outer edge serving as a junction; an upper dielectric layer above the electromagnetic resonance plate; and a differential transmission line pair composed of a pair of strip conductors overlapping with the electromagnetic resonance plate, above the upper dielectric layer. The conductor plate and the vias constitute an electromagnetic field confinement structure.
Public/Granted literature
- US20220279644A1 PRINTED CIRCUIT BOARD AND OPTICAL TRANSCEIVER Public/Granted day:2022-09-01
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