Invention Grant
- Patent Title: Bidirectional connector for server liquid cooling
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Application No.: US17483029Application Date: 2021-09-23
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Publication No.: US11792959B2Publication Date: 2023-10-17
- Inventor: Tianyi Gao
- Applicant: Baidu USA LLC
- Applicant Address: US CA Sunnyvale
- Assignee: BAIDU USA LLC
- Current Assignee: BAIDU USA LLC
- Current Assignee Address: US CA Sunnyvale
- Agency: WOMBLE BOND DICKINSON (US) LLP
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
According to one embodiment, a cooling assembly includes a cooling plate to be attached to an electronic device and a bidirectional connector for circulating cooling fluid to the cooling plate. The bidirectional connector includes a first tubing structure having a first fluid channel therein to supply the cooling fluid flowing in a first direction to the cooling plate, a second tubing structure that encloses the first tubing structure therein. The first tubing structure is positioned spaced apart from the second tubing structure to form a second fluid channel between an outer surface of the first tubing structure and an inner surface of the second tubing structure. The second fluid channel is configured to receive the cooling fluid returned from the cooling plate. The first and second fluid channels are configured to operate a supply and a return fluid streams in opposite directions, respectively.
Public/Granted literature
- US20230086534A1 BIDIRECTIONAL CONNECTOR FOR SERVER LIQUID COOLING Public/Granted day:2023-03-23
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