Invention Grant
- Patent Title: Semiconductor device including ferroelectric layer and method of manufacturing the same
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Application No.: US17317663Application Date: 2021-05-11
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Publication No.: US11792995B2Publication Date: 2023-10-17
- Inventor: Jae Gil Lee , Dong Ik Suh , Se Ho Lee
- Applicant: SK hynix Inc.
- Applicant Address: KR Icheon-si
- Assignee: SK hynix Inc.
- Current Assignee: SK hynix Inc.
- Current Assignee Address: KR Icheon-si
- Priority: KR 20200175878 2020.12.15
- Main IPC: H10B51/30
- IPC: H10B51/30 ; G11C11/22 ; H10B51/20 ; H01L21/28 ; H01L29/78 ; H01L29/51

Abstract:
A semiconductor device according to an embodiment includes a substrate, a bit line structure and a source line structure respectively extending in a direction perpendicular to a surface of the substrate, a semiconductor layer disposed between the bit line structure and the source line structure on a plane parallel to the surface of the substrate, a first ferroelectric layer disposed on a first surface of the semiconductor layer, and a first gate electrode layer disposed on the first ferroelectric layer.
Public/Granted literature
- US20220189972A1 SEMICONDUCTOR DEVICE INCLUDING FERROELECTRIC LAYER AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2022-06-16
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