Invention Grant
- Patent Title: Semiconductor structure with embedded memory device
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Application No.: US16926239Application Date: 2020-07-10
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Publication No.: US11793003B2Publication Date: 2023-10-17
- Inventor: Huang-Kui Chen , Guan-Jie Shen
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinch
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Sterne, Kessler, Goldstein & Fox P.L.L.C.
- Main IPC: H01L23/528
- IPC: H01L23/528 ; H10B63/00 ; H10N70/00 ; H10N70/20

Abstract:
The present disclosure describes a semiconductor structure and a method for forming the same. The semiconductor structure can include a substrate, a gate structure over the substrate, a source/drain (S/D) contact structure adjacent to the gate structure, a layer of dielectric material over the S/D contact structure, a conductor layer over and in contact with the layer of dielectric material and above the S/D contact structure, and an interconnect structure over and in contact with the conductor layer.
Public/Granted literature
- US20220013582A1 SEMICONDUCTOR STRUCTURE WITH EMBEDDED MEMORY DEVICE Public/Granted day:2022-01-13
Information query
IPC分类: